千住水溶性锡膏 M705-515A(8)C1-T8G（无卤素锡膏）及M705-WSG15为千住金属开发之水洗性锡膏.
１．Scope
This specification covers the solder paste,
ECO SOLDER PASTE M705-515A(8)C1-T8G, using lead-free solder alloy, used
for wiring connection and so on, of electrical and electronic parts.
２．Standard
２.１ Chemical composition of solder alloy（Test method ： STM-9-1）
Composition and impurities are prescribed as following tables.
Composition ( mass% )
Ａｇ3.0 ± 0.1 /Ｃｕ0.50 ± 0.05/Ｓｎ
２.２ Melting temperature range and specific gravity of solder alloy(Reference value)
Melting temperature range ℃
Approx. 217 ～ 220